PassPort 2 – Passport machine for laminating of covers and/or chip-inlays

The PassPort 2 machine laminates covers and/or chip-inlays onto layers sewn by PassPort 1. All passport machines by Kugler-Womako adhere to the strict quality guidelines of the ICAO and ISO for “Machine Readable Passports (MRP) and electronic passports.” All styles of passports and e-passports can be manufactured by combing the PassPort 2 with our PassPort 1, 3 and 4 machines.

Passport 2 basic equipment

  • Feeder for sewn layers

  • Seam gluing with cold glue

  • Feeding of cover material and/ or chip-inlays

  • Laminating of cover material or chip-inlays

  • Pressing of layers

  • Delivery

Add-on options

  • Seam gluing with UV curable glue

  • Secondary feeding and secondary lamination station for additional lamination of chip-inlays, to get chip-inlay and cover onto sewn layer in one working

  • Pile press

  • Chip verification with automatic rejection of defective chip-inlays (without interruption of the production process), marking rejects by labeling

  • Registration of Chip-UIDs used

  • Inline connection to PassPort 1 and PassPort 3